专利名称：Multi-chip module
发明人：Zimmerman, Jeffrey Scott,Rohrbaugh,
George Wilson
申请号：EP97302377.3申请日：19970407公开号：EP0803735B1公开日：20030326
摘要：A multi-chip-module (MCM) architecture allows direct access to a chip withminimum cost in space, yield, and signal delay. A first chip 13 of the MCM 10 is connectedto a second chip 11 via corresponding I/Os, but only the first chip has I/Os are directlyaccessible off the MCM. A coupling circuit, responsive to a control signal, passes signals inthe directly accessible I/Os of the first chip to the I/Os of the second chip.
申请人：IBM
地址：US
国籍：US
代理机构：Davies, Simon Robert
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