LEAD FRAME FOR SEMICONDUCTOR DEVICE

专利名称：LEAD FRAME FOR SEMICONDUCTOR DEVICE发明人：Joon Su Kim,Jung Soo Park,Gi Jeong Kim申请号：US13466717申请日：20120508

公开号：US20120299172A1公开日：20121129

专利附图：

摘要：Provided is a lead frame for a semiconductor device, which includes a base layermade of copper, a strike plating layer or a self assembly monolayer (SAM), therebypreventing oxidation of a base layer while simplifying the manufacturing process,reducing the manufacturing costs and reducing a failure ratio. In one embodiment, in the

lead frame for a semiconductor device including a die pad and a plurality of leadspositioned adjacent to each other around the die pad, the lead frame includes a baselayer made of copper; and a first strike plating layer formed on the one or more portionsof the surface of the base layer.

申请人：Joon Su Kim,Jung Soo Park,Gi Jeong Kim

地址：Kyunggi-do KR,Seoul KR,Kyunggi-do KR

国籍：KR,KR,KR

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