半导体测试面试测试题目
在各个领域，我们最离不开的就是试题了，借助试题可以更好地检查参考者的学习能力和其它能力。一份好的试题都是什么样子的呢？以下是小编收集整理的半导体测试面试测试题目，仅供参考，欢迎大家阅读。
1.The phone interviews involved some basic questions about background and a few technical questions about op amp circtuits and feedback around op amp. After that, I was invited for an all day, on-site
interview. During this interview, I interviewed with each member of the team (5+ hrs). I was offered the position once all interviews were completed and my manager received positive feedback.
Interview Question – Most of the questions were technical questions I expected (step response for a high-pass or low-pass RC filter, op amp circuits, etc.). One interview was different in that, he asked me to explain one of my projects to him as if he were a layman with no technical expertise (usingwhiteboard). Answer Question
2.Interview Details – Applied online. Received a call from an engineer and he interviewed me for 40 min. All were basic questions. setup & hold time? What can you do to prevent a system going into metastable? one hot and binary encoding?
3. Interview Details – Applied to intern via university recruiting and got an interview a week later. 45 minutes, half resume questions half technical, not a lot of time for questions or follow-up.
Interview Question – Small and large signal behavior and gain for a simple differential pair. Answer Question
4.Interview Details – Applied online, got an email to set up telephone interview with hiring manager, in the gap of one week phone and onsite interview
Interview Question – position required strong signal processing background, especially in filter design, questions related to Z transform were little difficult, thought I was supposed to get transfer function at the end Answer Question
5.Interview Details – Phone interview. The product engineer focused on asking the question regarding your resume and some basic circuit question such as filter and amplifier question.
Interview Question – ATE experience Answer Question
6.Interview Details – I applied through my school career services and I was contacted to schedule a phone interview. The interviewer was very flexible with the dates. At the agreed time, he called and we
discussed my qualifications, experience and interests. He also presented some technical questions about signals, noise, cascoding and other electronic concepts.He also provided a brief job description for the job position.The interview was comfortable and enlightening.
Interview Question – What are the disadvantages of Cascoding View Answer
7.Interview Details – Process took about 2 weeks.
I was selected on campus and had a phone screen by a manager where he mostly went over my resume.And then I was called for on site interview in a week.
Had three rounds, In which they gave design problems and asked me to solve them most of them are based on Verilog.
Also tested me on Clockdomains, timimg related questions, setup time hold time, clock tree.
Interview Question – Timing based questions were little tricky
8.Interview Details – On-campus interview.
Purely technical interview for 45 minutes - interviewer was not interested in prior work and did not know anything about the department (RF analog electronics) which I was interested in or the related field.
Questions asked:
Derive output and gain of simple amplifier (preferably without drawing small-signal model)
Draw Bode-plots for RLC filter
and more in the category of basic analog electronics
Did fairly well at the interview and received the interviewers business card but never heard from them again - no rejection, no nothing. Tried calling, emailing, calling HR, and absolutely no response. Got an automated email that theyll be back in office in 6 months. Weird.
Interview Question – No unexpected questions, but know your stuff - rehearse the fundamental
amplifier theory, circuit theory, filter theory and so on - everything pertaining to basic analog electronics. Be convincing, because the interviewer might try to get you to doubt your own answers even when theyre correct.
1.为什么硅会成为集成电路应用最广泛的半导体材料？
答：硅，锗，氮化镓都可用于半导体，硅相比于锗和氮化镓具有机械性能好，密度低（2.33 g/cm3），原材料充分（沙子），热力学性能好。锗材料最早使用，氮化镓目前用于高频or高速模拟电路。
2. 高纯度的多晶硅纯度是多少？
答：99.9999999%（11N）。
3. 利用熔融多晶硅制备单晶硅的方法有哪些？
答：直拉法（CZ法），磁控直拉法（MCZ法），悬浮区熔法（FZ法）。
4. 制备单晶硅的种子是什么？有什么要求？
答：籽晶。要求晶格必须保持完好，表面没有氧化层，没有划伤。使用籽晶拉出的单晶硅的晶向和籽晶是相同的。其作用就像是饱和食盐水结晶用的京种一样，可以降低向晶体转化的势垒能级。
5.晶圆的切片流程包括哪些步骤？
答：切断，滚圆，定晶向，切片，倒角，研磨，腐蚀，抛光，清洗和检验。
6.硅片都有哪些直径的？直径越大有什么优势？
答：3寸，4寸，6寸，8寸，12寸，18寸。目前主流的是12寸。
7. 什么是外延工艺？
答：在衬底上运用物理or化学的方法，规则的生长出半导体薄膜的工艺。
8. 什么是SOI技术，运用此技术有什么优点？
答：SOI：Silicon on Insulator。字面意思就是硅晶体管结构在绝缘体之上的意思，原理就是在硅晶体管之间，加入绝缘体物质，可使两者之间的寄生电容比原来的少上一倍。
9.在衬底上形成外延层有什么优点？
答：外延层的晶向和衬底相同，但是外延生长时掺入杂质的类型，浓度可以和衬底不同。例如
①在高掺杂的衬底上可以生长低掺杂外延层
②P型外延层可以生长在N型上直接形成PN结
③外延层厚度可以调节，多个外延层可连续生长，可通过该方法调节厚度，掺杂浓度等形成复杂结构的外延层。
10.外延层的缺点有哪些？
答：设备复杂，价格昂贵，外延层生长速度慢。
11. 外延层分类是怎样的？
答：
①按工艺方法分类：气相外延，液相外延，固相外延，分子束外延
②按外延层/衬底材料分类：同质外延和异质外延
③按工艺温度分类：高温外延，低温外延，变温外延。
④按外延层结构分类：普通外延，选择外延和多层外延。
12. 外延工艺有什么用途？
答：①可用来制作双极型晶体管。
②避免闩锁效应，避免硅表面氧化物的淀积。
13. 什么是氧化工艺？
答：在硅片的表面生长二氧化硅薄膜的工艺。
14. 二氧化硅的结构是什么样的？
答：正四面体结构，一个硅原子连接四个氧原子，一个氧原子连接两个硅原子。
15. 二氧化硅薄膜的作用是什么？
答：二氧化硅薄膜的作用有：器件的组成，离子注入掩蔽膜，金属互连层之间的绝缘介质，隔离工艺中的绝缘介质，钝化保护膜。
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